Intelligent Software

Powerful Image Processing Algorithms and Analysis Tools

Analyze BGA’s, QFN’s and related bottom terminated devices automatically to render detailed pass/fail reporting for complex multi-layered/double-sided board designs. Easily recall or import settings for the best image quality utilizing user created system setting templates stored to the library.

Detect, Analyze, Report

Voiding (individual pocket percentage and cumulative percentage totals)
BGA Sphere Circularity
Pass/Fail Detection
Bridging

(Optimum Pro Module Standard)

Image Processing Filters and Enhancement Tools

Sharpen, Smooth, Edge Detect, Emboss, Background Subtract, Negative, 3D Gray Plot, Psuedo Color, Image Histogram
Post Capture Image Enhancement Library
Point to point Distance Measurement tool
Image Annotation Tools
Quad View

Semiconductor Measurement Tools (Pro Advanced Module)

Bond Wire Sweep
Die Attach Void Measurement
Pass/Fail Analysis

Gull Wing, QFP, SOIC, Measurement tools (Pro Advanced Module)

Joint Area Measurement
Percent Void
Pass/Fail Analysis

Drill Offset Measurement (Pro Advanced Module)

Center to Center Offset (X,Y) Measurement.